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  3. Moving Probe Tester
  4. Measurement System

Measurement System

MicroCraft's Revolutionary Measurement System

EMMA series advanced technology moving probe fixtureless tester performs continuity and isolation tests simultaneously on both sides of a PCB. Current design includes four/eight moving probes, high-speed closed loop servo/linear motors, advanced technology firmware and easy to use 'Windows' interface. The EMMA series testers will lower your overall electrical test cost while dramatically improving productivity.

HVS(High Voltage Stress) Test Optional

HVS(High Voltage Stress) TestHVS (High Voltage Stress Test) is a measurement system that is capable of detecting high resistance isolation defect which was undetectable with Phase Difference Measurement (PDM). HVS is conducted by applying high voltage pulses between signal lines to detect high resistance defect. HVS similar to PDM, inspects each net once, thus achieves much faster test speed compared to ordinary isolation test by resistance measurement. This revolutionary testing method can be upgraded as an option to our EMMA series.

High Voltage(up to 1000V)Resistance Measurement Optional

As to maximum applicable voltage with standard isolation resistance measurement is 250V, this offers the option of applying maximum of 500V/1000V for highly reliable high resistance isolation test.

Super High Resistance Isolation Measurement Unit Optional

List of External meter currently supportedThis is an option to detect super high resistance isolation defect by applying lower test voltage. The usage of low voltage allows users to conduct super high resistance test without adding high stress on the tested boards.
* Applicable for E4 and F2 models in our EMMA lineup.

Micro Short Detection

Sudden application of high voltage in isolation test may result in burning out of parts containing Micro Short. This is caused by carbonized residue possibly reacting with moisture in the air or gases in the factory, which causes the element to relapse as high resistance short error after the test is complete. Our Micro-short test avoids such damage and trouble by applying a low voltage (less than 30V) before gradually increasing the applying voltage. Again, high resistance short between multiple layers of a broad may possess the characteristics of semiconductor and capacitors. These errors can also be detected in our test by reversing the polarity of high voltage.

Connection with External Meter Optional

In conjunction with MicroCraft's standard measuring electronics, external specialized meters can be accommodated by GPIB interface and USB connection. Examples are such as measuring extreme isolation and high voltage up to 1TOhm, and LCR and diode support as well.

List of External meter currently supported
Keysight Technologies (formerly Agilent Technologies)
34410A Digital Multimeter (USB), 34420A Micro-Ohm Meter (GPIB),
3458A Digital Multimeter (GPIB), B2985A Electro Meter (USB),
4284A LCR Meter (GPIB), 4285A LCR Meter (GPIB),
E4980A LCR Meter (USB), 4339B High Resistance Meter (GPIB)
Keithley Instruments Inc.
6487 Picoammeter (GPIB)
Kelvin Probe Optional

4 wire-4 point measurementPrecision Resistance Measurement
A 4 wire, 4 points measurement method by Kelvin probe allows high accuracy testing by low resistance. Furthermore, measuring Buried Resistance and saving the measured values are also included.

Min. resolution: 0.001mΩ
Also can check probe contact error
RangeResolutionPractical rangeCurrentApplication
4mΩ0.001mΩ0.4-3mΩ150mAKelvin Probe
40mΩ0.01mΩ2-30mΩ125mAKelvin Probe
400mΩ0.1mΩ30-300mΩ125mAWith Kelvin Probe
1mΩ0.3-3Ω125mAKelvin Probe
1000Ω250mΩ50-800Ω 2.5mA
10kΩ2.5Ω500-8kΩ 0.25mA
100kΩ25Ω5k-80kΩ 25µABuried Resistance
1MΩ250Ω50k-800kΩ 2.5µABuried Resistance

Contact Check During Isolation TestingContact Check During Isolation Testing
In order to improve isolation test accuracy, this feature enables users to verify probes are correctly in contact with the pad prior to testing. This contact check function effectively assist the user during pad search.

LATENT Testing Optional

LATENT TestingLatent test is the highest fault detection technology. Latent not only detects the existing defects, but also is capable of finding dormant ones having the possibility of becoming a permanent defect in the near future. This testing method enhances the product reliability.

The pattern with “latent” dormant defect, when applied with high current will induce temperature rise causing the output resistance to become nonlinear. This change shall be detected at high speed and accuracy and thus detect Latent defect.